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2019-10-01Merge branch 'v1.4'Kévin Redon3-8093/+7923
2019-10-01Merge branch 'v1.3'Kévin Redon9-17069/+12311
2019-10-01Merge branch 'v1.2_production'Kévin Redon5-5627/+6625
2019-10-01Merge branch 'v1.1_production'Kévin Redon6-4637/+6867
2019-10-01Merge branch 'v1.0_production'Kévin Redon6-6864/+9396
2014-06-23export schematic, and pcb (with minor esthetic corrections)Kevin Redon1-6272/+6204
2014-06-20v1.4: Connect PA0 to 3V3; pull-up for PA1/PA2 (R25,R26)Harald Welte2-1961/+2007
2014-06-20Schematic: Make sure PA0 to PA2 are high on power-upHarald Welte1-353/+205
2013-11-11simtrace 1.3: move point of origin to lower left corner of PCBHarald Welte1-5550/+5550
2013-10-28BOM corrected (sorted by value) and reformatedKevin Redon3-34/+15
2013-10-27MCU pin 48 used to identify v1.3 by putting it to ground (with internal pull-up)Kevin Redon5-21794/+6086
2013-10-27exported fabrication filesKevin Redon1-25/+2
2013-10-27new components placed and routedKevin Redon1-1679/+1643
2013-10-27MBR0530 pin numbers correctedKevin Redon6-228/+251
2013-10-27new KiCAD layout format, silkscreen refdes 0.5mm, text 0.75mm, new components...Kevin Redon1-0/+10632
2013-10-27set footprints to symbolsKevin Redon1-17/+45
2013-10-27exported v1.3 netlistKevin Redon1-1005/+1135
2013-10-27v1.3 modifications: replaced IC switch with FPF2109, added schottky and pull-...Kevin Redon1-166/+390
2013-10-27added FPF210X symbol to libraryKevin Redon3-3/+62
2012-05-18RST_PHONE pulldown added on PCBKevin Redon3-1381/+1790
2012-05-17Add R23 (pull-up for !SIM_RST signal)Harald Welte1-47/+58
2012-05-16v1.2p fabrication exportedKevin Redon3-50/+46
2012-05-16C14 change to 4.7uF 0805, silkscreen improved, more space for JTAGKevin Redon4-1912/+1334
2012-05-15DRC rules violations correctedKevin Redon1-657/+517
2012-05-15SIMtrace: Improve PCB routing of GND, 3V3 and VCC tracesHarald Welte1-4148/+5879
2012-03-16production version of SIM-SAM adapterHarald Welte4-0/+605
2012-02-18simadapter: proper naming of componentsHarald Welte1-5/+5
2012-02-18add SAM-to-FPC-adapterHarald Welte1-0/+113
2011-12-15FFC: add edges of stiffener to Eco1 layerHarald Welte1-5/+158
2011-12-14FFC: add "sysmocom" text on copper layer of all four adaptersHarald Welte1-61/+86
2011-12-07hw: SIM card is smaller (14.9mm instead of 15mm) to better fit in the slotKevin Redon1-101/+50
2011-11-05Merge branch 'master' of git.osmocom.org:simtraceKevin Redon1-45/+45
2011-11-05hw: sysmocom added to copper, gerber renderedKevin Redon2-187/+2339
2011-11-05hw: solder mask between at91sam7s addedKevin Redon1-325/+3996
2011-11-05VPP connected through bus switchKevin Redon3-5287/+1915
2011-11-03+1.8V line enlarged on C12, C15, C16. not possible on C19Kevin Redon1-225/+184
2011-11-03footprint refreched, cap near LDOKevin Redon5-2112/+2151
2011-11-01ftdi 3.3v cut in schemaKevin Redon1-17/+4
2011-10-31simffc: make sure PCB edges really are on the edge, not on Eco2 layerHarald Welte1-45/+45
2011-10-26cap placed near to CPU, some tracks redrawnKevin Redon1-5096/+490
2011-08-13microSIM footprint addedKevin Redon1-7/+74
2011-08-13microSIM schema created (cpoied from normal SIM)Kevin Redon4-0/+588
2011-08-13ftdi vcc disconnectedKevin Redon2-265/+252
2011-08-13cap near cpu, routing improvedKevin Redon2-4414/+4689
2011-07-08connection rounded (2.0mm radius) and copper addedKevin Redon2-437/+895
2011-07-07flex board sim cables created (pcb edge are wrong)Kevin Redon5-1/+1744
2011-07-02v1.0p corrected and rendered. BOM updatedv1.0_productionKevin Redon1-73/+89
2011-07-02D2 and D3 now also use STPS340U instead of 1N5819Kevin Redon4-593/+505
2011-07-02LED now uses 0805 footprint instead of 0603Kevin Redon4-1361/+1948
2011-07-02PS/gerber rendered for productionKevin Redon1-300/+167