|author||Harald Welte <firstname.lastname@example.org>||2012-07-15 12:11:03 +0200|
|committer||Harald Welte <email@example.com>||2019-06-22 11:59:27 +0200|
final v3 as it goes in pcb production
* smash components and move labels to where they can be read * add indication of + / GND to X3/X4 * re-route some traces to ensure sufficient distance between them * make all traces 0.508 mm wide, even signal traces.
Diffstat (limited to 'mpcie-breakout')
0 files changed, 0 insertions, 0 deletions