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authorHarald Welte <laforge@osmocom.org>2020-09-10 22:50:23 +0200
committerHarald Welte <laforge@osmocom.org>2020-09-10 22:50:23 +0200
commitcdd8f3c4d4cb69caffc50e4e6a179a7d4118826f (patch)
tree070d7ea08b5f622e9788f7a50bb8fc8ef27727eb
parentba452d6f699b49db79cfc4800e1315a2e3f45d2e (diff)
mpcie-breakout: Remove GND via underneath U.FL connectorsHEADmaster
-rw-r--r--mpcie-breakout/mpcie-breakout.brd9
-rw-r--r--mpcie-breakout/mpcie-breakout.sch38
2 files changed, 41 insertions, 6 deletions
diff --git a/mpcie-breakout/mpcie-breakout.brd b/mpcie-breakout/mpcie-breakout.brd
index 0b91163..fb459c1 100644
--- a/mpcie-breakout/mpcie-breakout.brd
+++ b/mpcie-breakout/mpcie-breakout.brd
@@ -28,7 +28,7 @@
<layer number="18" name="Vias" color="2" fill="1" visible="yes" active="yes"/>
<layer number="19" name="Unrouted" color="6" fill="1" visible="yes" active="yes"/>
<layer number="20" name="Dimension" color="15" fill="1" visible="yes" active="yes"/>
-<layer number="21" name="tPlace" color="7" fill="1" visible="no" active="yes"/>
+<layer number="21" name="tPlace" color="7" fill="1" visible="yes" active="yes"/>
<layer number="22" name="bPlace" color="7" fill="1" visible="yes" active="yes"/>
<layer number="23" name="tOrigins" color="15" fill="1" visible="yes" active="yes"/>
<layer number="24" name="bOrigins" color="15" fill="1" visible="yes" active="yes"/>
@@ -748,6 +748,8 @@ Source: http://www.osram.convergy.de/ ... Lb_q993.pdf</description>
<wire x1="1.5" y1="-1.5" x2="1.5" y2="-1.3" width="0.127" layer="21"/>
<text x="-3" y="0" size="1.27" layer="25" rot="R90" align="center">&gt;NAME</text>
<text x="3" y="0" size="1.27" layer="27" rot="R90" align="center">&gt;VALUE</text>
+<rectangle x1="-0.9" y1="-0.95" x2="0.9" y2="1.27" layer="41"/>
+<rectangle x1="-0.9" y1="-0.95" x2="0.9" y2="1.27" layer="43"/>
</package>
</packages>
</library>
@@ -2109,7 +2111,7 @@ Source: www.farnell.com/datasheets/247.pdf</description>
</library>
</libraries>
<attributes>
-<attribute name="VERSION" value="v3"/>
+<attribute name="VERSION" value="v3.1"/>
</attributes>
<variantdefs>
</variantdefs>
@@ -3030,9 +3032,6 @@ design rules under a new name.</description>
<via x="-8.89" y="26.162" extent="1-16" drill="0.3"/>
<via x="-7.366" y="26.162" extent="1-16" drill="0.3"/>
<via x="-5.842" y="24.892" extent="1-16" drill="0.3"/>
-<via x="-8.128" y="23.368" extent="1-16" drill="0.3"/>
-<via x="-8.128" y="13.208" extent="1-16" drill="0.3"/>
-<via x="-3.302" y="11.684" extent="1-16" drill="0.3"/>
<via x="-5.842" y="23.622" extent="1-16" drill="0.3"/>
<via x="-5.842" y="21.844" extent="1-16" drill="0.3"/>
<via x="-8.128" y="20.32" extent="1-16" drill="0.3"/>
diff --git a/mpcie-breakout/mpcie-breakout.sch b/mpcie-breakout/mpcie-breakout.sch
index 903200c..d750848 100644
--- a/mpcie-breakout/mpcie-breakout.sch
+++ b/mpcie-breakout/mpcie-breakout.sch
@@ -4001,6 +4001,30 @@ High volt MLC; no solder stop between for higher isolation</description>
<wire x1="1.5" y1="-1.5" x2="1.5" y2="-1.3" width="0.127" layer="21"/>
<text x="-3" y="0" size="1.27" layer="25" rot="R90" align="center">&gt;NAME</text>
<text x="3" y="0" size="1.27" layer="27" rot="R90" align="center">&gt;VALUE</text>
+<rectangle x1="-0.9" y1="-0.95" x2="0.9" y2="1.27" layer="41"/>
+<rectangle x1="-0.9" y1="-0.95" x2="0.9" y2="1.27" layer="43"/>
+</package>
+<package name="SMA-F-S-TH-73251-2201">
+<description>Molex 73251-2201</description>
+<pad name="C" x="0" y="0" drill="1.5"/>
+<pad name="G1" x="-2.54" y="2.54" drill="1.5"/>
+<pad name="G2" x="2.54" y="2.54" drill="1.5"/>
+<pad name="G4" x="2.54" y="-2.54" drill="1.5"/>
+<pad name="G3" x="-2.54" y="-2.54" drill="1.5"/>
+<text x="-3.81" y="4.1275" size="1.27" layer="25" font="vector" ratio="10">&gt;NAME</text>
+<text x="-3.81" y="-5.3975" size="1.27" layer="27" font="vector" ratio="10">&gt;VALUE</text>
+<wire x1="-5.08" y1="3.25" x2="-16.51" y2="3.25" width="0.127" layer="21"/>
+<wire x1="-16.51" y1="3.25" x2="-16.51" y2="-3.25" width="0.127" layer="21"/>
+<wire x1="-16.51" y1="-3.25" x2="-5.08" y2="-3.25" width="0.127" layer="21"/>
+<wire x1="-5.08" y1="3.5" x2="-5.08" y2="3.25" width="0.127" layer="21"/>
+<wire x1="-5.08" y1="3.25" x2="-5.08" y2="-3.25" width="0.127" layer="21"/>
+<wire x1="-5.08" y1="-3.25" x2="-5.08" y2="-3.5" width="0.127" layer="21"/>
+<wire x1="-3.5" y1="3.5" x2="3.05" y2="3.5" width="0.127" layer="21"/>
+<wire x1="3.05" y1="3.5" x2="3.05" y2="-3.5" width="0.127" layer="21"/>
+<wire x1="3.05" y1="-3.5" x2="-3.5" y2="-3.5" width="0.127" layer="21"/>
+<wire x1="-3.5" y1="-3.5" x2="-3.5" y2="3.5" width="0.127" layer="21"/>
+<wire x1="-3.5" y1="-3.5" x2="-5.08" y2="-3.5" width="0.127" layer="21"/>
+<wire x1="-5.08" y1="3.5" x2="-3.5" y2="3.5" width="0.127" layer="21"/>
</package>
</packages>
<symbols>
@@ -4118,6 +4142,18 @@ High volt MLC; no solder stop between for higher isolation</description>
<technology name=""/>
</technologies>
</device>
+<device name="73251-2201" package="SMA-F-S-TH-73251-2201">
+<connects>
+<connect gate="G" pin="1" pad="C"/>
+<connect gate="G" pin="GND@1" pad="G1"/>
+<connect gate="G" pin="GND@2" pad="G2"/>
+<connect gate="G" pin="GND@3" pad="G3"/>
+<connect gate="G" pin="GND@4" pad="G4"/>
+</connects>
+<technologies>
+<technology name=""/>
+</technologies>
+</device>
</devices>
</deviceset>
<deviceset name="HRS_UFL" prefix="X" uservalue="yes">
@@ -12483,7 +12519,7 @@ DIN A4, landscape with extra doc field</description>
</library>
</libraries>
<attributes>
-<attribute name="VERSION" value="v3"/>
+<attribute name="VERSION" value="v3.1"/>
</attributes>
<variantdefs>
</variantdefs>